Publications

Solid State Foaming of Nickel, Monel, and Copper by the Reduction and Expansion of NiO and CuO Dispersions.

Faculty Author(s): Atwater, Mark A.
Student Author(s): -
Department: AEST
Publication: Advanced Engineering Materials
Year: 2018
Abstract: Nickel and its alloys are useful in a range of applications, and nickel foams have increased in popularity for functional applications, such as electrodes. Despite their versatility and interest for burgeoning technologies, there is only one well‐developed method for producing porous nickel commercially. This work introduces a simple method for creating porosity in nickel and Monel (70% Ni, 30% Cu) that results in sub‐micron to micron‐scale pores and grains. This is accomplished by creating oxide dispersions in the metallic matrix and then reducing those oxides at elevated temperature to form pores. It is found that nickel and Monel reach maximum porosity at 800 °C with Monel reaching a higher overall porosity (33% vs. 25% for Ni), whereas Cu exhibited 40% porosity under the same conditions. Varied matrix and oxide pairings are examined microstructurally, and the effects of matrix strength, oxide chemistry, and other factors are considered to determine factors in pore development. Uniquely, this method produces pores within individual metallic particles, so this porosity can be added to other powder methods of solid state foaming to enhance the performance in functional applications. [ABSTRACT FROM AUTHOR] Copyright of Advanced Engineering Materials is the property of John Wiley & Sons, Inc. and its content may not be copied or emailed to multiple sites or posted to a listserv without the copyright holder's express written permission. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)
Link: Solid State Foaming of Nickel, Monel, and Copper by the Reduction and Expansion of NiO and CuO Dispersions.